ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,003, issued on June 23, was assigned to SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY Co. LTD. (Shenzhen, China). "L... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,004, issued on June 23, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor package" was invented by Xiao... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,005, issued on June 23, was assigned to Japan Display Inc. (Tokyo). "Display device" was invented by Shuichi Osawa (Tokyo), Yoshikatsu Imaz... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,006, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuit packages with hybrid bonded dies and methods... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,007, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea). "Diode and bipolar junction transistor for 3D SFET with... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,008, issued on June 23, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Display device" was invented by Hyowon Kwon (Suwon-si, S... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,009, issued on June 23, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Stacked die package and methods of forming the same" was invente... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,010, issued on June 23, was assigned to DYNEX SEMICONDUCTOR Ltd. (Lincoln, Great Britain) and ZHUZHOU CRRC TIMES SEMICONDUCTOR Co. LTD (Huna... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,011, issued on June 23, was assigned to Shin-Etsu Chemical Co. Ltd. (Tokyo). "Advanced lift method and apparatus for transferring optical d... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,012, issued on June 23, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Clustering fine pitch micro-bumps for packag... Read More